Easy Print Solder Paste 20g for soldering SMD components
Non-returnable
BD 8.900
Out of stock
EASY PRINT Sn62/Pb36/Ag2 20g A "No Clean" type paste is designed for soldering SMD components in production processes that do not include washing phase.
Apart from metals powders, the product composition includes resin based and solvent based flux, activtors that remove oxides and thixotropic additions, responsible for viscosity and plasticity. The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
Apart from metals powders, the product composition includes resin based and solvent based flux, activtors that remove oxides and thixotropic additions, responsible for viscosity and plasticity. The paste does not lose its physical and chemical properties even after being left for 20 hours on the PCB. This time depends on conditions in room: humidity and temperature.
Product Details
- it does not contain chlorides
- flux residue neither corrodes, nor requires washing
- soldered joints have good mechanical and electrical properties
- Melting point: 179°C
- Application: electronics, electrotechnics, automatic soldering, manual soldering, surface mounting.
- flux residue neither corrodes, nor requires washing
- soldered joints have good mechanical and electrical properties
- Paste for soft soldering.
- Flux resin: 15%- Melting point: 179°C
- Application: electronics, electrotechnics, automatic soldering, manual soldering, surface mounting.